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Singapore, September 29, 2026 — As AI computing continues to scale rapidly, 1.6T near-package optical interconnect technology is approaching a critical transition from sample validation to commercial deployment. FIBERSTAMP has completed a shippable engineering sample of a socket-based 1.6T NPO solution defined under OIF standards, demonstrating the transmission performance of near-package optical interconnects for ultra-high-bandwidth applications.

Singapore, September 17 , 2026  –  As AI computing continues to scale, data center networks are rapidly advancing toward 1.6T high-speed interconnects, driving greater requirements for optical module power efficiency, link stability, and deployment flexibility. To address these requirements, FIBERSTAMP has launched the HYBRID 1.6T OSFP224-HRO 2×DR4 heterogeneous silicon photonics transceiver, featuring FIBERSTAMP’s proprietary HYBRID

—Featuring an Integrated 10.1-inch Industrial Touchscreen and Removable Battery for True Standalone 800G/400G/200G PAM4 BER Testing Singapore, August 4 , 2026  FIBERSTAMP today announced the launch of the Visual 800G CHECKER, an enhanced version of its portable 800G/400G/200G PAM4 Bit Error Rate Tester (BERT). By integrating a 10.1-inch industrial touchscreen tablet and a removable battery module

Singapore, June 18, 2026 — FIBERSTAMP, a provider of advanced optical interconnect solutions, today announced the release of its latest white paper, “Next-Generation AI Computing Network Architecture and Optical Interconnect Technology Analysis.” The white paper provides a comprehensive analysis of four key optical interconnect technology approaches designed for next-generation AI computing networks. For short-reach interconnect