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AI 800G / 1.6T Data Center MPO Fiber Cabling Solution for Next-Gen Data Centers

FIBERSTAMP’s AI 800G / 1.6T Data Center MPO Fiber Cabling Solution provides a complete, high-performance cabling system engineered for high-speed data center fabrics supporting 800G and 1.6T networks. This solution combines a comprehensive portfolio of MPO/MTP fiber cabling components with optimized design features to maximize density, minimize link loss, and simplify deployment and maintenance. Key […]

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Passive xWDM Devices Solution – Compact CWDM & DWDM Components for Flexible Optical Networks

FIBERSTAMP’s Passive xWDM Devices Solution offers a comprehensive portfolio of passive wavelength division multiplexing (WDM) devices designed to simplify and optimize optical networks. This solution family includes CWDM, DWDM, and compact WDM modules that require no electrical power and deliver reliable, cost-effective optical signal aggregation across metro, access, and transport networks. Solution Overview Our passive

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SDI High-Definition Video Optical Solution – 12G SDI CWDM/DWDM Optical Transport up to 40 km

FIBERSTAMP’s SDI High-Definition Video Optical Solution delivers robust, long-reach optical transport for professional broadcast and video production environments, supporting SD-SDI through 12G-SDI high-definition signals over optical fiber. This solution uses CWDM and DWDM optical modules and extenders to enable high-quality video transmission for studio, live event, and outdoor broadcast applications. Key Features Application Scenarios FIBERSTAMP’s

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400G Single-Wavelength DCI BOX Coherent Subsystem Solution

FIBERSTAMP’s 400G Single-Wavelength DCI BOX Coherent Subsystem Solution delivers a high-capacity, cost-efficient optical transport platform for data center interconnect (DCI) and metro applications. It uses the latest 400G QSFP-DD ZR/ZR+ coherent optical modules integrated in a modular DCI BOX chassis to support scalable, long-reach coherent links with simplified deployment and enhanced spectral efficiency. Core Solution

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800G Single-Wavelength DCI BOX Coherent Subsystem Solution for Long-Reach Data Center Interconnects

FIBERSTAMP’s Single-Wavelength 800G DCI BOX Coherent Subsystem Solution delivers next-generation optical transport by leveraging single-wavelength 800G coherent transmission to optimize data center interconnect (DCI) links with high bandwidth density and enhanced transmission efficiency. This solution combines advanced CFP2-DCO coherent transceiver technology with flexible deployment options to meet the growing demands of cross-domain connectivity across compute

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COLOR ZR+ C-Band DWDM Optical Solution for Long-Reach Transport

FIBERSTAMP’s COLOR ZR+ C-Band DWDM Optical Solution delivers high-capacity, long-distance optical transport using a compact 100G QSFP28 PSM DWDM4 optical module with an MPO-12 interface. When paired with external wavelength multiplexing, dispersion compensation (DCM), and amplification (EDFA), this solution enables extended optical links up to 80 km, meeting the demands of metro, data center interconnect

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COLOR X SiPh DWDM Optical Solution for Metro, DCI & 5G Fronthaul

FIBERSTAMP’s COLOR X SiPh DWDM Optical Solution delivers a complete O-Band DWDM (Dense Wavelength Division Multiplexing) interconnect platform optimized for metro access, data center interconnect (DCI), and 5G fronthaul networks. Operating in the O-Band with 200 GHz channel spacing, this solution supports high-capacity DWDM links using compact silicon photonics-based transceivers and subsystems, simplifying network design

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Immersion Liquid-Cooling Optical Extender Solutions for High-Density Optical Networks

FIBERSTAMP’s Immersion Liquid-Cooling Optical Extender Solutions extend liquid-cooling interconnect technology to optical extenders, enabling reliable, low-power optical connectivity in high-heat-density environments such as AI compute clusters, hyperscale data centers, and 5G fronthaul applications. These extenders work alongside immersion liquid-cooled optical modules and active optical cables to support future-ready interconnects from 25G up to 800G and

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400G DR4 & 800G DR8 Immersion Liquid-Cooling Silicon Photonics Modules

FIBERSTAMP’s Immersion Liquid-Cooling Silicon Photonics Modules deliver next-level performance for high-density, high-power network environments by combining silicon photonics integration with liquid cooling technology. Designed for both 400G and 800G applications, these modules address thermal challenges in AI computing and hyperscale data centers, enabling higher energy efficiency and power-optimized operation. Key Technology Features By integrating liquid

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100G SFP56-DD SR2 Optical Interconnect Solution

The 100G SFP56-DD SR2 Optical Module delivers 100 Gbps high-speed optical performance in an ultra-compact, double-density form factor — ideal for dense data center and cloud network environments. Built on 2×50G PAM4 modulation, this solution supports high-performance links while preserving a small physical footprint for maximum port density. Key Features: Applications: This solution helps network

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