SINGAPORE, October 9, 2026 — FIBERSTAMPwill showcase its HYBRID 1.6T 2×DR4 heterogeneous silicon photonics transceiver at OCP Global Summit 2026, taking place October 12–15 in San Jose, California. The demonstration highlights FIBERSTAMP’s latest developments in high-speed optical interconnects, HYBRID half-DSP architecture, and silicon photonics for next-generation AI data centers.
HYBRID 1.6T 2×DR4 Key Features
Combining silicon photonics with FIBERSTAMP’s HYBRID half-DSP architecture, the 1.6T 2×DR4 transceiver delivers an aggregate bandwidth of 1.6 Tbps.
Key features include:
- 18W Maximum Power Consumption: Supports air-cooled data center deployments while helping reduce thermal demands in high-density racks.
- 28%–35% Lower Power Consumption: Delivers power savings compared with a comparable 3nm full-DSP solution.
- Up to 500m Reach: Supports transmission distances of up to 500 meters over single-mode fiber (SMF).
- DSP Capabilities on Key Channels: Provides DSP capabilities for signal enhancement, clock alignment, and phase synchronization to support link stability and power efficiency.
- Heterogeneous Silicon Photonics Architecture: Balances power efficiency, performance, and system integration flexibility.
Live Demonstrations of High-Speed Optical Interconnect Solutions
FIBERSTAMP will also demonstrate a range of optical interconnect products and technologies designed for AI data center applications, including:
- 800G OSFP-HRO DR8
- 800G Visual CHECKER
- 1.6T NPO Optical Engine
These demonstrations showcase FIBERSTAMP’s capabilities across high-speed pluggable optics, optical module testing, and next-generation NPO optical engines.
Exhibition Details：
- Date: October 12–15, 2026
- Location: San Jose, California, USA
- Booth: T11
Visit FIBERSTAMP at Booth T11 to explore the HYBRID 1.6T 2×DR4 transceiver and discover high-speed optical interconnect solutions for next-generation AI data centers.
