2026

FIBERSTAMP Demonstrates 800G HYBRID ACC+ Active Copper Cable and 800G HYBRID Silicon Photonics Module at DesignCon 2026

Leave a Comment / 2026, Company Activities /

Singapore, February 11, 2026 — FIBERSTAMP announced that it will exhibit at DesignCon 2026, where it will demonstrate its next-generation 800G HYBRID ACC+ Active Copper Cable and an 800G silicon photonics module based on the HYBRID architecture. DesignCon 2026 will be held from February 24–26, 2026, at the Santa Clara Convention Center, Santa Clara, California. […]

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Why HYBRID Architectures Outperform LRO in Real-World Systems—and Are Reshaping Short-Reach Interconnects in AI Data Centers

Leave a Comment / 2026, Product News /

1. Introduction: AI and Data Center Short-Reach Interconnects Must Return to System Engineering Reality As AI and data center interconnects accelerate toward 800G and 1.6T, short-reach optical connectivity is no longer a question of power optimization alone. It has evolved into a system-level engineering challenge, encompassing port density, thermal design, link stability, and large-scale deployability.

Why HYBRID Architectures Outperform LRO in Real-World Systems—and Are Reshaping Short-Reach Interconnects in AI Data Centers Read More »

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