2026

FIBERSTAMP Releases White Paper on Next-Generation AI Computing Network Architecture and Optical Interconnect Technology Analysis

Singapore, June 18, 2026 — FIBERSTAMP, a provider of advanced optical interconnect solutions, today announced the release of its latest white paper, “Next-Generation AI Computing Network Architecture and Optical Interconnect Technology Analysis.” The white paper provides a comprehensive analysis of four key optical interconnect technology approaches designed for next-generation AI computing networks. For short-reach interconnect […]

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FIBERSTAMP Announces Office Relocation and Official Launch of Singapore TAA Manufacturing Initiative

Singapore — May 18, 2026 — FIBERSTAMP today announced the official opening of its new Singapore office, now fully operational at:  33 Ubi Ave 3,Tower A,Room 08-64,Singapore 408868. In parallel with the office relocation, FIBERSTAMP also announced the launch of its Singapore manufacturing initiative under the Trade Agreements Act (TAA), further strengthening the company’s global

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FIBERSTAMP Showcases 48G SDI Optical Interconnect and O-Band 12G SDI DWDM Solutions at NAB Show 2026

Singapore, April 10, 2026 — FIBERSTAMP, a global provider of open optical networking solutions, will present its latest 48G SDI optical interconnect solution and O-Band 12G SDI DWDM transmission solution at NAB Show 2026, addressing the increasing demand for high-quality, long-distance 8K baseband video transmission in broadcast, live production, sports, and large-scale event environments. 48G

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Paving the Way for Cost-Effective DWDM Transmission — FIBERSTAMP Showcases O-Band 400G DWDM4 Direct-Detect Optical Module and Subsystem at OFC 2026

Singapore, March 12, 2026 —At the upcoming OFC 2026 in Los Angeles, FIBERSTAMP will unveil its exclusively developed O-band 400G DWDM4 optical modules and transmission subsystems. Leveraging the zero-dispersion characteristics of the O-band, FIBERSTAMP delivers a more economical, simplified, and efficient 400GE interconnect solution for global data center connectivity. Traditionally, the C-band has dominated long-haul transmission.

Paving the Way for Cost-Effective DWDM Transmission — FIBERSTAMP Showcases O-Band 400G DWDM4 Direct-Detect Optical Module and Subsystem at OFC 2026 Read More »

OFC 2026 — Live Demonstration of the 1.6T DR16-NPO Silicon Photonics Engine and HYBRID Green Interconnect Innovations

Singapore, March 12, 2026 — As global data center networks rapidly accelerate toward the 800G and 1.6T era, ultra-high-speed optical interconnect technologies are entering a new phase of innovation. OFC 2026, held at the Los Angeles Convention Center, brings together leading innovators across the optical communications industry. At this year’s exhibition, FIBERSTAMP showcases its next-generation

OFC 2026 — Live Demonstration of the 1.6T DR16-NPO Silicon Photonics Engine and HYBRID Green Interconnect Innovations Read More »

FIBERSTAMP Wins 2026 Lightwave Innovation Award — HYBRID 800G ACC+, 800G AOC, and 1.6T Silicon Photonics Active Optical Cables Honored

Singapore – February 27, 2026 – FIBERSTAMP today announced that three of its next-generation HYBRID interconnect solutions have been recognized in the 2026 Lightwave Innovation Reviews, presented by Lightwave, a leading authority in optical networking and communications technology. The awarded products include: This recognition underscores industry validation of FIBERSTAMP’s pioneering advancements and meaningful contributions to hybrid-architecture

FIBERSTAMP Wins 2026 Lightwave Innovation Award — HYBRID 800G ACC+, 800G AOC, and 1.6T Silicon Photonics Active Optical Cables Honored Read More »

FIBERSTAMP Demonstrates 800G HYBRID ACC+ Active Copper Cable and 800G HYBRID Silicon Photonics Module at DesignCon 2026

Singapore, February 11, 2026 — FIBERSTAMP announced that it will exhibit at DesignCon 2026, where it will demonstrate its next-generation 800G HYBRID ACC+ Active Copper Cable and an 800G silicon photonics module based on the HYBRID architecture. DesignCon 2026 will be held from February 24–26, 2026, at the Santa Clara Convention Center, Santa Clara, California.

FIBERSTAMP Demonstrates 800G HYBRID ACC+ Active Copper Cable and 800G HYBRID Silicon Photonics Module at DesignCon 2026 Read More »

Why HYBRID Architectures Outperform LRO in Real-World Systems—and Are Reshaping Short-Reach Interconnects in AI Data Centers

1. Introduction: AI and Data Center Short-Reach Interconnects Must Return to System Engineering Reality As AI and data center interconnects accelerate toward 800G and 1.6T, short-reach optical connectivity is no longer a question of power optimization alone. It has evolved into a system-level engineering challenge, encompassing port density, thermal design, link stability, and large-scale deployability.

Why HYBRID Architectures Outperform LRO in Real-World Systems—and Are Reshaping Short-Reach Interconnects in AI Data Centers Read More »