2026

Singapore, March 12, 2026 —At the upcoming OFC 2026 in Los Angeles, FIBERSTAMP will unveil its exclusively developed O-band 400G DWDM4 optical modules and transmission subsystems. Leveraging the zero-dispersion characteristics of the O-band, FIBERSTAMP delivers a more economical, simplified, and efficient 400GE interconnect solution for global data center connectivity. Traditionally, the C-band has dominated long-haul transmission.

Singapore, March 12, 2026 — As global data center networks rapidly accelerate toward the 800G and 1.6T era, ultra-high-speed optical interconnect technologies are entering a new phase of innovation. OFC 2026, held at the Los Angeles Convention Center, brings together leading innovators across the optical communications industry. At this year’s exhibition, FIBERSTAMP showcases its next-generation

Singapore, February 11, 2026 — FIBERSTAMP announced that it will exhibit at DesignCon 2026, where it will demonstrate its next-generation 800G HYBRID ACC+ Active Copper Cable and an 800G silicon photonics module based on the HYBRID architecture. DesignCon 2026 will be held from February 24–26, 2026, at the Santa Clara Convention Center, Santa Clara, California.