Singapore, February 11, 2026 — FIBERSTAMP announced that it will exhibit at DesignCon 2026, where it will demonstrate its next-generation 800G HYBRID ACC+ Active Copper Cable and an 800G silicon photonics module based on the HYBRID architecture. DesignCon 2026 will be held from February 24–26, 2026, at the Santa Clara Convention Center, Santa Clara, California.
Product 1: 800G OSFP HYBRID ACC+ Active Copper Cable
The 800G OSFP HYBRID ACC+ Active Copper Cable is built on a HYBRID half-DSP architecture, in which DSP-based signal compensation is implemented on only one side of the link—either the host side or the line side. This design maintains high-speed signal integrity and link stability while significantly reducing power consumption, link latency, and overall system cost.
The product was characterized and tuned using FIBERSTAMP’s in-house checker test platform and was successfully validated on an NVIDIA 800G InfiniBand switch platform. Test results confirm full compatibility with 800G switch ports at a transmission distance of 5 meters, with the following performance metrics:
- Data Rate: 800 Gbps (8 × 100G)
- Maximum Reach: ≥ 5 meters
- Typical Power Consumption: ~5.5 W per end
- Link Latency (5 m): ~100 ns
- Pre-FEC BER: Stable at the 1E-9 level
- Post-FEC BER: Up to 1E-15 or better
- Eye Opening Info FOM: Majority of channels above 70
Compared with conventional AEC solutions under equivalent transmission conditions, HYBRID ACC+ delivers approximately 40% improvement in power efficiency, latency, and cost, providing a high-performance and cost-effective short-reach interconnect option for high-density data center deployments.
As the HYBRID solution adopts a half-DSP architecture, achieving optimal system-level performance typically requires joint tuning and validation with original equipment manufacturers (OEMs) during deployment.
Product 2: 800G OSFP-PHO 2×DR4 Silicon Photonics Module Based on HYBRID Architecture
FIBERSTAMP also showcases its 800G OSFP-PHO 2×DR4 silicon photonics module, designed on the HYBRID architecture. The module supports configurations from 800G OSFP112-PHO 2×DR4 to 2 × 400G DR4 (QSFP112 / OSFP-RHS), addressing 500-meter-class short- to mid-reach optical interconnect requirements in data center environments.
Key technical features include:
- Module Power Consumption: < 12.5 W, approximately 20% lower than traditional full-DSP optical modules.
- Transmission Reach: Up to 500 meters over single-mode fiber (SMF) with KP4-FEC enabled.
- Link Latency : Approximately 50% lower than conventional DSP-based architectures.
- Signal Quality: Pre-FEC BER reaching the E-10 level.
High-Temperature Fiber Transmission BER
Experimental results demonstrate that HYBRID half-DSP technology can effectively compensate for channel loss, making high-performance, cost-efficient 800G optical interconnect upgrades technically feasible for hyperscale data centers and cloud service providers.
Under the current LRO operating mode, the receiver link still exhibits a limited post-correction symbol margin (slightly above 10), which requires collaborative system-level tuning with OEM partners to further optimize end-to-end link performance.
Invitation to DesignCon 2026
FIBERSTAMP cordially invites media representatives, industry analysts, and partners to visit DesignCon 2026 (Booth #1456) to explore these two innovative solutions and engage in technical discussions.
The company also looks forward to working closely with customers and ecosystem partners to jointly advance the HYBRID pluggable green interconnect product portfolio, enabling HYBRID design methodologies to move beyond laboratory validation and deliver tangible benefits to AI and data center computing infrastructure.
