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FIBERSTAMP’s Immersion Liquid-Cooling Silicon Photonics Modules deliver next-level performance for high-density, high-power network environments by combining silicon photonics integration with liquid cooling technology. Designed for both 400G and 800G applications, these modules address thermal challenges in AI computing and hyperscale data centers, enabling higher energy efficiency and power-optimized operation. Key Technology Features By integrating liquid

The 100G SFP56-DD SR2 Optical Module delivers 100 Gbps high-speed optical performance in an ultra-compact, double-density form factor — ideal for dense data center and cloud network environments. Built on 2×50G PAM4 modulation, this solution supports high-performance links while preserving a small physical footprint for maximum port density. Key Features： Applications： This solution helps network

The FIBERSTAMP 200G QSFP56 SR2 optical interconnect solution is engineered to meet the demanding bandwidth, low power, and broad compatibility requirements of next-generation data centers, AI clusters, and cloud computing environments. Built on advanced 2×100G PAM4 modulation, this solution delivers 200 Gbps optical performance with excellent energy efficiency and wide interoperability. Technical Highlights Product Name

The 400G QSFP-DD ER4-30 Optical Interconnect Solution from FIBERSTAMP delivers robust, long-reach 400 Gbps transmission over dual fiber up to 30 km — ideal for metro DCI (Data Center Interconnect) scenarios and extended data center networking. This solution harnesses advanced APD receiver technology and low-dispersion wavelength emission to ensure stable, high-speed optical performance across diverse

The 800G FR8 Optical Interconnect Solution from FIBERSTAMP delivers high-speed 800 Gbps optical transmission up to 2 km using advanced 8-lane wavelength-division multiplexing (LWDM) over standard duplex fibers. By enabling 800G Ethernet over dual LC fiber with built-in MUX/DEMUX, this solution simplifies deployment and reduces fiber requirements and operating costs compared with traditional 800G 2×FR4

The 800G Hybrid Optical Interconnect Solution delivers a high-performance, power-efficient alternative to traditional 800G OSFP active optical cables (AOCs) and optical modules. By adopting a patented Hybrid architecture, this solution reduces power consumption and latency while maintaining robust transmission performance — making it ideal for AI-centric and hyperscale data center interconnects. What Makes the Hybrid

The 400G QSFP-DD Hybrid VR8-AOC from FIBERSTAMP harnesses our patented Hybrid Active Optical Cable (Hybrid AOC) technology, delivering a next-generation interconnect solution that outperforms traditional DSP-centric active optical cables in power, latency, and cost efficiency. By applying DSP to only half of the optical channels and combining industry-proven LPO/LRO design concepts with advanced system-level signal

FIBERSTAMP’s Hybrid Architecture Active Copper Cable (ACC+) solutions redefine high-speed copper interconnects for AI, hyperscale data center, and cloud networking systems. By leveraging a patented Hybrid architecture that combines the strengths of existing PCC/ACC and AEC methodologies, these cables deliver dramatically lower power, latency, and cost compared with conventional active copper cables — while maintaining

FIBERSTAMP’s Hybrid Architecture Active Optical Cable (AOC) portfolio delivers a new generation of high-speed, energy-efficient optical interconnects for AI, hyperscale data center, and cloud infrastructures. Based on a patented Hybrid interconnect architecture, these AOC solutions combine advanced system-level signal alignment with flexible implementation options — including VCSEL-based and silicon photonics-based designs — for superior performance