FIBERSTAMP’s Immersion Liquid-Cooling Optical Extender Solutions extend liquid-cooling interconnect technology to optical extenders, enabling reliable, low-power optical connectivity in high-heat-density environments such as AI compute clusters, hyperscale data centers, and 5G fronthaul applications. These extenders work alongside immersion liquid-cooled optical modules and active optical cables to support future-ready interconnects from 25G up to 800G and pave the way toward 1.6T deployments.
Solution Highlights
- High-Speed Extension: Supports up to 0.5 m extension for most rates and up to 0.3 m for 800G links, ensuring stable performance across short optical paths.
- Broad Compatibility: Works with major pluggable form factors including SFP112, QSFP28, QSFP-DD, OSFP, and others — covering optical rates from 25G to 800G and laying groundwork for future 1.6T solutions.
- Thermal Optimization: Integrated 1.5 W silent fan in the extender socket enhances heat dissipation for stable, continuous operation in thermally demanding systems.
- User-Friendly Design: Built-in visual indicators simplify plug-and-play use and help protect switch ports for long-term system reliability.
Product Portfolio
FIBERSTAMP’s extender series includes a range of high-speed liquid-cooling extenders for:
- 100G (QSFP28) — up to 0.5 m
- 200G (QSFP56) — up to 0.5 m
- 400G (QSFP-DD) — up to 0.5 m
- 800G (QSFP-DD) — up to 0.3 m
Additional variants and future options span up to OSFP-RHS and 1.6T-compatible formats.
Typical Applications
- Immersion liquid-cooled data center interconnects
- 5G fronthaul networks
- High-density optical switching platforms
By combining liquid cooling extensibility with broad form-factor support, this solution enables efficient heat management, high-speed optical transmission, and reliable plug-and-play deployment for modern high-performance networks.
