FIBERSTAMP’s Immersion Liquid-Cooling Silicon Photonics Modules deliver next-level performance for high-density, high-power network environments by combining silicon photonics integration with liquid cooling technology. Designed for both 400G and 800G applications, these modules address thermal challenges in AI computing and hyperscale data centers, enabling higher energy efficiency and power-optimized operation.
Key Technology Features
- Silicon Photonics Integration: Highly integrated, low-power design that supports high-speed transmission at 400G/800G and paves the way for future 1.6T connectivity.
- Advanced Packaging: Hermetically sealed housing with high thermal conductivity materials improves cooling efficiency by up to 50% in liquid environments and sustains reliable performance at elevated thermal loads.
- Broad Compatibility: Supports multiple form factors — including QSFP112, QSFP-DD, OSFP, and OSFP-RHS — and is compatible with existing 100G–800G modules and future 1.6T products.
- CPO-Ready: Offers ultra-low-power options for next-generation co-packaged optics (CPO) switch platforms.
- Flexible Coolant Support: Compatible with a range of liquid coolants such as fluorinated liquids, mineral oil, and silicone oil.
By integrating liquid cooling with high-performance silicon photonics, this solution enhances energy efficiency and thermal control while maintaining high-speed optical transmission across demanding network environments.
