Singapore, September 17 , 2026 – As AI computing continues to scale, data center networks are rapidly advancing toward 1.6T high-speed interconnects, driving greater requirements for optical module power efficiency, link stability, and deployment flexibility.
To address these requirements, FIBERSTAMP has launched the HYBRID 1.6T OSFP224-HRO 2×DR4 heterogeneous silicon photonics transceiver, featuring FIBERSTAMP’s proprietary HYBRID half-DSP architecture. With a maximum operating power of just 18W, the transceiver reduces power consumption while maintaining high-speed link performance, transmission stability, and system configurability.
1.6T High-Speed Interconnect: Balancing Power Efficiency and Deployment Flexibility
As 1.6T optical modules move toward large-scale deployment, power consumption and thermal management are becoming increasingly important in high-density data center network design. Compared with higher-power full-DSP architectures, the FIBERSTAMP HYBRID architecture reduces DSP processing overhead, limiting maximum module power to 18W and providing greater thermal headroom for 1.6T high-speed interconnects.
In high-density AI data center environments, lower module power helps reduce overall thermal load while offering greater deployment flexibility for traditional air-cooled data centers and existing air-cooled switch platforms.
HYBRID Half-DSP Architecture: Balancing Low Power and Link Performance
The FIBERSTAMP HYBRID 1.6T OSFP224-HRO 2×DR4 features a proprietary half-DSP architecture that retains essential DSP signal processing on key channels while reducing overall DSP processing overhead.
Through cross-channel signal enhancement, clock calibration, and phase synchronization, the HYBRID architecture improves high-speed link stability and system adaptability while maintaining a low-power design, achieving a balance between power efficiency and link performance.
Four Key Advantages：
1. 18W Low-Power Design for Air-Cooled Deployment
The FIBERSTAMP HYBRID 1.6T OSFP224-HRO 2×DR4 has a maximum operating power of just 18W, delivering approximately 28%–35% lower power consumption than mainstream 3nm full-DSP solutions with comparable specifications.
Lower module power reduces the thermal load on high-density 1.6T switches, providing greater thermal headroom for air-cooled data centers and existing air-cooled switch platforms. It also helps reduce long-term energy consumption and Total Cost of Ownership (TCO).
2. Stable Transmission Across the Full Temperature Range, with BER Performance Exceeding Protocol Requirements
Across the full operating temperature range, the product’s eight-channel BER performance exceeds the relevant requirements of the 1.6T OSFP-DR8 specification. Supporting transmission distances of up to 500m over single-mode fiber, the transceiver is designed for high-speed interconnects across AI cluster PODs, rack-to-rack links, and short- to medium-distance data center applications.
3. Cross-Channel Coordination for Low Power and Link Stability
The FIBERSTAMP HYBRID half-DSP architecture retains key-channel DSP signal processing and supports cross-channel signal enhancement, clock calibration, and phase synchronization.
By reducing DSP processing overhead while maintaining essential signal processing capabilities, the architecture improves high-speed link stability and system adaptability, providing a 1.6T solution that balances power efficiency and performance for large-scale deployment.
4. Open DSP Tuning for Greater Customer Configuration Flexibility
The HYBRID solution retains an open host-side DSP tuning interface, allowing users to independently configure signal equalization, optical power, and gain strategies based on actual link conditions.
This open tuning capability enables users to optimize link performance according to transmission distance, fiber conditions, and system requirements, providing a more flexible and configurable approach to high-speed optical interconnects.
1.6T Interconnect for AI Clusters and Data Center Upgrades
For next-generation AI infrastructure, FIBERSTAMP will continue to advance HYBRID, silicon photonics, and high-speed optical interconnect technologies, delivering flexible and efficient interconnect solutions as data center networks evolve toward 1.6T.
