Choosing the Right OSFP: Balancing Performance and Thermal Innovation
As AI supercomputing, HPC, and next-gen data centers evolve, high-speed connectivity isn’t enough—efficient thermal management is now critical. FIBERSTAMP OSFP modules offer flexible packaging options to match different cooling scenarios, helping you maximize performance and energy efficiency. Three OSFP Packaging Options: Finned-Top OSFP Top fins improve airflow and cooling 13.00 mm height, air-cooled switches compatible […]
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