FIBERSTAMP to Showcase Immersion Liquid-Cooled 800G Optical Module and 800G Optical Extender at SC 2025
Singapore, November 7, 2025 — FIBERSTAMP will showcase its latest generation of liquid-cooled optical interconnect solutions at the Supercomputing 2025 (SC 2025) exhibition, taking place in St. Louis, USA, from November 16 to 21, 2025. At Booth #4008, FIBERSTAMP will present a live demonstration of its immersion liquid-cooled 800G optical module and 800G optical extender series, […]









