April 28, 2025 — FIBERSTAMP announced the official launch of its cutting-edge 200G QSFP56 SR2 optical module. Built on advanced 2×100G PAM4 modulation technology, the module delivers ultra-high speed, low latency, and broad compatibility — providing a future-ready connectivity solution for next-generation data centers.
Technology-Driven Innovation: Breaking Barriers in Speed and Efficiency
As data centers rapidly transition to 200G/400G architectures, traditional optical modules are reaching their limits in terms of speed, power efficiency, and interoperability. FIBERSTAMP’s 200G QSFP56 SR2 optical module delivers a leap in performance through three key innovations—pushing the boundaries of what’s possible in next-gen network infrastructure.
High-Speed, Low-Power Performance
- Supports 200Gbps (2×100G PAM4) transmission to meet the bandwidth demands of AI/GPU clusters, cloud computing, and other data-intensive applications.
- Built with advanced energy-efficient design, the module achieves up to 30% lower power consumption compared to traditional solutions—supporting the development of greener, low-carbon data centers.
Broad Compatibility and Flexible Connectivity
- Eliminates switch platform limitations with support for multiple interface standards, including 400G QSFP112 and 400G QSFP56-DD.
- Enables diverse AOC interconnect configurations for seamless integration across heterogeneous devices, significantly reducing the cost and complexity of network upgrades.
Certified Reliability for Mission-Critical Networks
The FIBERSTAMP 200G QSFP56 SR2 optical module has passed multiple industry certifications, fully complying with QSFP56 MSA and IEEE 802.3 standards. When paired with OM4 multimode fiber, it supports transmission distances of up to 100 meters (SR2), making it ideal for short-reach interconnects within data centers.
400G QSFP112 AOC to 2×200G QSFP56 SR2 Breakout
Breaking through device port limitations and enabling flexible 400G-to-200G interconnects. This innovation is perfectly suitable for high-speed, heterogeneous network architectures.
400G QSFP56-DD SR4 AOC Breakout to 2×200G QSFP56 SR2
Meeting the need for efficient interconnects across various switch environments, enabling flexible deployment in data centers.
800G OSFP SR8 Breakout to 4×200G QSFP56 SR2
Unlock maximum flexibility by breaking out a single 800G OSFP SR8 port into four 200G QSFP56 SR2 —ideal for scalable, high-density deployments in modern data centers.
Comprehensive Coverage of Core Application Scenarios
- Data Center Architecture Upgrades: Supports 200G spine-leaf network transformations, effectively easing port density constraints and optimizing data center resource allocation.
- Heterogeneous Network Integration: Addresses protocol and speed mismatches in multi-vendor environments, reducing operational complexity and accelerating network evolution.
- Accelerated AI Compute Interconnects: Delivers high-speed, low-latency connectivity for AI training, high-performance computing, and other bandwidth-intensive workloads.
FIBERSTAMP has long been committed to driving industry transformation through technological innovation, with years of deep expertise in optical modules. The newly launched 200G QSFP56 SR2 module not only fills a critical gap in the market for high-performance, cost-effective short-reach interconnect solutions, but also introduces an innovative breakout design that empowers customers to build more efficient and open data center network eco-systems.
For more information, please feel free to contact FIBERSTAMP sales team.
Email Address: sales@fiberstamp.com
Telephone Number: +65 6022 0607
