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LPO and CPO: A Strategic Turning Point and Parallel Evolution in Optical Interconnect Architectures

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As AI workloads scale and data center architectures evolve, optical interconnect technology is undergoing a fundamental transformation. Traditional pluggable optics are being challenged by two emerging approaches—Linear-drive Pluggable Optics (LPO) and Co-packaged Optics (CPO)—both driven by the industry’s urgent need for lower power consumption, higher bandwidth density, and improved system efficiency. At the heart of […]

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Ultra-Low-Latency Optics Are Reinventing Financial Trading Networks

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As high-frequency trading (HFT), AI inference, and edge computing infrastructure push toward real-time responsiveness, network architects are reevaluating one of the most overlooked layers of the stack: the optical interconnect. Historically, optical transceivers have been optimized around bandwidth and reach. But as system-level latency becomes a profit driver and performance bottleneck, particularly in nanosecond-sensitive environments,

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FIBERSTAMP Launches 2×100G PAM4-Based 200G QSFP56 SR2 Optical Module to Power Next-Gen Data Center Connectivity

Leave a Comment / 2025, Preview, Product News /

April 28, 2025  —  FIBERSTAMP announced the official launch of its cutting-edge 200G QSFP56 SR2 optical module. Built on advanced 2×100G PAM4 modulation technology, the module delivers ultra-high speed, low latency, and broad compatibility — providing a future-ready connectivity solution for next-generation data centers. Technology-Driven Innovation: Breaking Barriers in Speed and EfficiencyAs data centers rapidly transition

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FIBERSTAMP will exhibit AI 800G high-speed AOC and DAC interconnect I/O assembly and immersible liquid cooling interconnect at SC24!

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November 18, 2024. Singapore – SC24 is an International Conference for High Performance Computing, Networking, Storage, and Analysis that will be held in Atlanta USA during November 17-22, 2024. FIBERSTAMP will exhibit AI 800G high-speed AOC and DAC interconnect I/O assembly and immersible liquid cooling interconnect at the exhibition. We are looking forwarding to seeing you at our booth No.623!

FIBERSTAMP will exhibit AI 800G high-speed AOC and DAC interconnect I/O assembly and immersible liquid cooling interconnect at SC24! Read More »

FIBERSTAMP Will Present 400G DCI BOX, Coherent and Metro Telecom Optical Transceivers At Network X!

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September 29, 2024. Singapore – Network X 2024 (formerly BBWF), as the “Oscar” event in the global telecommunications field, will be opened at the Porte de Versailles International Exhibition Center in Paris on October 8-10, France time. The exhibition will gather Telecom, 5G, Broadband,Cloud and other related fields. FIBERSTAMP, as a global open optical network

FIBERSTAMP Will Present 400G DCI BOX, Coherent and Metro Telecom Optical Transceivers At Network X! Read More »

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