As AI supercomputing, HPC, and next-gen data centers evolve, high-speed connectivity isn’t enough—efficient thermal management is now critical. FIBERSTAMP OSFP modules offer flexible packaging options to match different cooling scenarios, helping you maximize performance and energy efficiency.
Three OSFP Packaging Options：
Finned-Top OSFP
Top fins improve airflow and cooling
13.00 mm height, air-cooled switches compatible
Ideal for traditional rack-mounted switches
Example: 800G OSFP SR8 VCSEL 850nm 100m MMF MPO Optical Transceiver
Close-Top OSFP
Smooth top with ventilation holes, internal heat structure
13.00 mm height, fully compatible with Finned-Top
Optimized for airflow in air-cooled systems
Example: SiPh 800G OSFP DR8 1310nm 500m SMF MPO Optical Transceiver
Flat-Top OSFP (OSFP-RHS)
Flat, no fins or openings
Slim 9.50 mm height, fits liquid-cooling plates or external heat sinks
Perfect for liquid-cooled servers, high-density GPU racks, or OEM systems
Example: 400G OSFP-RHS SR4 VCSEL 850nm 100m MMF MPO Optical Transceiver
Application Scenarios (Illustrated with NVIDIA Use Cases)
Finned Top ↔ Finned Top
Ideal for air-cooled OSFP switches, such as standard Ethernet switches relying on chassis fan airflow for cooling.
Finned Top ↔ Flat Top
Suited for hybrid cooling setups, like NVIDIA DGX H100 Cedar systems connecting to air-cooled switches. The DGX rack uses liquid cooling internally, while switches remain air-cooled—requiring a Finned-to-Flat configuration to bridge different thermal environments.
Flat Top ↔ Flat Top
Designed for fully liquid-cooled OEM systems or back-to-back adapter testing. Here, air cooling is insufficient, so modules must make direct contact with cold plates or heat sinks to ensure optimal thermal performance and reliability.
Why Thermal Design Matters
With increasing compute demands, data centers are moving from traditional air-cooling to liquid-cooling and hybrid setups. Choosing the right OSFP package ensures:
Maximum airflow utilization in air-cooled systems
Efficient heat transfer in liquid-cooled or high-density setups
Flexibility with mixed-use or future upgrades
FIBERSTAMP’s OSFP modules provide the right thermal solution for your performance needs, ensuring reliable connectivity and higher energy efficiency.
