Following its official entry into the Optical Internetworking Forum (OIF) in June, FIBERSTAMP, an emerging leader in silicon photonics and differentiated optical interconnect solutions, today announced that it has officially joined the Open Compute Project (OCP) as a Community Member.
The Open Compute Project (OCP), founded by Meta (formerly Facebook) in 2011, is a global open hardware initiative committed to redefining the design, standardization, and deployment of data center infrastructure through collaborative innovation. The OCP ecosystem brings together leading hyperscale operators, cloud providers, equipment manufacturers, and component suppliers to drive the development of next-generation, energy-efficient, and scalable ICT infrastructure.
By joining the OCP Community, FIBERSTAMP aims to leverage the platform over the next two to three years to introduce its visionary interconnect architectures and highly differentiated products to the AI and data center (DC) industries. These offerings are designed to address current technical and commercialization bottlenecks in the interconnect space, contributing to the evolution of global AI and DC infrastructure—and supporting the advancement of open, next-generation telecom networks.
Looking ahead, FIBERSTAMP will actively participate in OCP working groups, contribute to specification development, and engage in the broader open hardware collaboration process. The company also plans to pursue OCP Accepted™ and OCP Inspired™ certifications for its proprietary solutions, with the goal of expanding deployment opportunities and increasing its visibility within the global open hardware ecosystem.
At the same time, FIBERSTAMP will continue to build on its strengths in key technology areas—including high-speed optical transceivers, silicon photonics, co-packaged optics (CPO), and liquid-cooled interconnects—further cementing its position as an innovation-driven contributor to the future of open data infrastructure.
