Fiberstamp’s way to Silicon Photonics development

FIBERSTAMP has been in the silicon optics industry since 2018 and already has the following basic capabilities:

High-performance silicon optical transceiver module hardware design platform
  • DSP-driver-TIA type selection design, mainstream brand IC, low batch risk
  • high frequency SI design, excellent module service transmission performance
  • Thermal design, modules with low power consumption

The silicon optical coupling technology platform of the whole series of technical solutions
  • LD to PIC end coupler free space single/double lens coupling
  • Single mode FA to PIC end coupler optical waveguide physical field mode matching coupling
  • High efficiency optical coupling of 42.5 degree grinding single mode FA and GeSi PD arrays
Highly reliable optical package structure
  • All modules passed the dual 85 reliability 500h test.
Automatic silicon optical production line with monthly output of 10K
  • COC-DB-WB- Coupling – Test – Packaging

FIEBRSTAMP has substantially entered the research and development of silicon optical chips and silicon optical transceivers. At least 10 silicon optical modules have been completed in the mass production or sample phase. Thanks to the close cooperation of the global supply chain, there will be more innovation in the future. FIBERSTAMP will continue to introduce unique and differentiated silicon optical modules. The following mature silicon light series products have been successfully launched and are widely used in the client side:

800G Silico Photonics Transceivers
  • 800G OSFP DR8/DR8+/DR8++
  • 800G OSFP 2xFR4 /2xLR4
  • 800G QSFP-DD DR8/DR8+/DR8++
  • 800G QSFP-DD 2xFR4/2xLR4

400G Silico Photonics Transceivers
  • 400G OSFP-RHS DR4/DR4+/DR4++
  • 400G OSFP-RHS FR4/LR4
  • 400G QSFP112 DR4/DR4+/DR4++
  • 400G QSFP112 FR4/LR4
  • 400G QSFP-DD FR4/LR4
  • 400G QSFP-DD DR4/DR4+

100G Silicon Photonics Transceivers
  • 100G QSFP28 DR1/FR1/ER1
  • 100G QSFP28 DWDM1

FIBERSTAMP will continue to work on the silicon optical road and plans to launch a series of pluggable 1.6T silicon optical modules for AI computing data centers in 2025:

  • 800G OSFP224 DR4/DR4+(200G SERDES )
  • 1.6T OSFP224 DR8 /DR8+(200G SERDES )

At the same time, the company will market the XT2-1.6-T-DR8 CPO silicon optical engine based on 200G PAM4 silicon optical chip modulation and CPO co-package optical design.


As an Open Optical Network Mail Carrier, FIBERSTAMP is committed to providing global users with Economic, Professional and Efficient Open Optical Network Solutions. The current main products cover 25G/50G/100G/200G/400G optical transceiver modules, Active Optical Cables (AOCs) and Direct Attached Cables (DACs), 100G/200G/400G coherent optical modules and UHD video transmission products. Meanwhile, through long-term deep digging in new technology, FIBERSTAMP is rapidly evolving to the promising era of 800G and CPO based on Silicon Photonics!