FIBERSTAMP Unveils Innovative Data Center Optical Interconnect Solutions and Network Diversion Best Practices at NA Cyber Security Expo

Singapore, May 10th 2023 – FIBERSTAMP is honored to be invited to the North American Cyber Security and Cloud Expo. William Tan, the Marketing Director, will be speaking at the Santa Clara Convention Center in California on May 18th, 2023.

As businesses migrate to the cloud, data transmission becomes more massive and complex, bringing higher risks to network security and data protection in data centers. To address this challenge, FIBERSTAMP will be sharing its data center optical interconnection solution and best practices in network traffic diversion devices, focusing on the internal optical-electronic interconnection in IDC, IDC traffic diversion, and IDC metro network interconnection architecture. In addition, FIBERSTAMP will look forward to live meetings and discussions with North American operators and cloud service providers at booth 276 during the exhibition on May 17-18.

Datacenter Interconnect Architecture

Internal Optical Interconnect Architecture and Middleware in IDC

FIBERSTAMP understands that the internal optical interconnect architecture in IDC is the cornerstone of modern data center networks, as it is a key factor in achieving high-speed, reliable, and low-latency data transmission, and improving data storage security, computing performance, and reliability. Therefore, FIBERSTAMP provides large-scale data center architectures with different rates of 100G/200G/400G/800G, empowering customers in different application scenarios to enhance data center performance and security.

IDC Diversion: Best Practices for Parallel Optical Module Technology

In the IDC diversion – best practices of parallel optical module technology, parallel optical modules can combine multiple fibers or multiple wavelength-division multiplexing channels in network diversion for higher bandwidth density, meeting the needs of high-density data centers in network security applications. With multiple fibers transmitting in parallel, cable length and complexity can be reduced, improving transmission reliability and stability.

IDC Diversion Diagram

FIBERSTAMP showcases a variety of parallel optical modules with different transmission rates to meet the diverse needs of segmented markets.

IDC Metro Interconnect: Coherent DCI BOX subsystems and coherent modules

IDC metro interconnect based on coherent wavelength division multiplexing (WDM) technology offers advantages such as long transmission distances, low signal attenuation, and high bandwidth. FIBERSTAMP offers a range of high-performance coherent modules and advanced modulation technologies, along with large-capacity DCI box subsystem equipment to achieve high-speed data transmission over ultra-long distances for data backup and disaster recovery, improving data security.

Applications Architecture – 100G Single Lambda Side Span Of 200km, EDFA+ Raman Double Amplification

FIBERSTAMP Coherent DCI BOX Subsystem and Coherent Module Product List

In the digital era, optical interconnect in data centers has become an important means of high-speed connectivity. As an excellent provider of open optical network middleware, FIBERSTAMP is committed to adopting new technologies and designs to add value to optical networks and continuously optimize optical interconnect solutions for data centers. North American operators and cloud service providers can achieve more efficient data transmission and security by working with FIBERSTAMP. We look forward to exchanging ideas with you at the exhibition and waiting for your visit at Booth 276!


As an Open Optical Network Mail Carrier, FIBERSTAMP is committed to providing global users with Economic, Professional and Efficient Open Optical Network Solutions. The current main products cover 25G/50G/100G/200G/400G optical transceiver modules, Active Optical Cables (AOCs) and Direct Attached Cables (DACs), 100G/200G/400G coherent optical modules and UHD video transmission products. Meanwhile, through long-term deep digging in new technology, FIBERSTAMP is rapidly evolving to the promising era of 800G and CPO based on Silicon Photonics!