The 400G DR4 Linear NPO Silicon Photonic Engine leverages linear direct-drive technology to deliver a high-performance, energy-efficient optical interconnect solution for next-generation AI and cloud data centers.
Compared with conventional NPO architectures, the Linear NPO Silicon Photonic Engine eliminates onboard DSPs through a linear direct-drive architecture, significantly reducing system-level power consumption, latency, and overall deployment cost.

Key Performance
Output Power: 0-3dBm (Typical: 4-5dB)
TDECQ: <2.5dB (Typical: 1-2dB)
Wavelength Range: 1304.5nm – 1317.5nm; SMSR ≤30dB
Sensitivity: <5.5dBm

Application Scenarios
Lower power consumption and enhanced system interconnection reliability, enabling next-generation DSP-free switches.
Designed to address system signal consistency and reliability challenges,combining the advantages of Linear Pluggable Optics (LPO) and Near-Packaged Optics (NPO).This cutting-edge solution paves the way for the future of high-speed, energy-efficient data transmission.

The XT-1.6T DR16/DR16+ Linear NPO Silicon Photonic Engine is a high-performance optical interconnect solution designed for next-generation AI data centers and high-performance computing (HPC) applications.

Built on a Near-Packaged Optics (NPO) architecture, it positions the optical engine adjacent to the switch ASIC, enabling 1.6Tbps optical connectivity through DR16/DR16+ interfaces. Leveraging a DSP-free linear architecture, the engine delivers high bandwidth, low power consumption, low latency, and improved signal integrity, making it an ideal solution for next-generation AI and cloud infrastructure.

Key Features:
Supports 16 × 100G PAM4 signaling (53 Gbaud per lane)
Advanced Silicon Photonic Modulator chip
Integrated Linear Driver and TIA
Power consumption <16 W
Up to 2 km transmission over 1310 nm single-mode fiber
High-performance External Laser Source (ELS)
Electrical Interface: OIF CEI-112G-XSR
Mechanical Interface: OIF Co-Packaging 3.2T Module 1.0
Management Interface: OIF CMIS 5.3