Paving the Way for Cost-Effective DWDM Transmission — FIBERSTAMP Showcases O-Band 400G DWDM4 Direct-Detect Optical Module and Subsystem at OFC 2026

Singapore, March 12, 2026 —At the upcoming OFC 2026 in Los Angeles, FIBERSTAMP will unveil its exclusively developed O-band 400G DWDM4 optical modules and transmission subsystems. Leveraging the zero-dispersion characteristics of the O-band, FIBERSTAMP delivers a more economical, simplified, and efficient 400GE interconnect solution for global data center connectivity.

Traditionally, the C-band has dominated long-haul transmission. However, for DCI “last-mile” applications spanning 2 km to 30 km, its cost structure is increasingly difficult to justify. FIBERSTAMP’s O-band (1310 nm) DWDM technology, with its naturally low-dispersion transmission window, establishes a new benchmark for cost-efficient 400GE data center interconnects.

400G QSFP-DD PSM DWDM4 Optical Module

Key Advantages:

DCM-Free Operation: Operating within the O-band’s low-dispersion window eliminates the need for bulky and costly dispersion compensation modules (DCM), simplifying line card design while reducing insertion loss.

Ultra-Low Power Consumption: Advanced silicon photonics integration enables industry-leading power efficiency, making the solution ideal for high-density data center deployments.

Cost-Optimized Architecture: For short- to mid-reach DCI applications, the solution avoids the complexity of coherent C-band transceivers, providing a high-performance direct-detect architecture that significantly reduces CapEx.

Ultra-Low Latency: By eliminating DSP-based dispersion compensation required in coherent optics, the module greatly reduces optical transmission latency, enabling faster data center interconnect performance.

Product Brief Description

FeatureSpecification
Optical InterfaceMPO-12 / APC
Modulation4 × 100G PAM4 silicon photonic modulators
Transmission Distance10 km or up to 30 km with external SOA
Core TechnologyO-band DWDM4 (scalable to 16 wavelengths),
enabling 4 × 400GE high-capacity interconnect
Form Factor400G QSFP-DD
Power ConsumptionTypical 10 W, Max < 11 W
Key FeatureOperates in the zero-dispersion window (no external DCM required)
Target ApplicationsHyperscale DCI, Enterprise Interconnect, Edge Compute Backhaul
400G QSFP-DD DWDM4 O-Band DCI Applications (10–30 km)

OFC 2026 Live Demonstration

FIBERSTAMP warmly invites visitors to our booth for a live end-to-end demonstration of the O-band 400G DWDM4 transmission system. The demonstration will feature:

  • 400G DCI chassis
  • 400G QSFP-DD OEO line cards
  • 200 GHz O-band DWDM MUX/DEMUX modules

FIBERSTAMP provides a complete turnkey solution, demonstrating how the O-band architecture can reduce network deployment costs by approximately 50% while delivering efficient and scalable DCI connectivity.

Event: OFC 2026, Los Angeles, CA, USA

FIBERSTAMP Booth: #2416

Live Demo: “O-Band 400G DWDM4 Transmission in Action”

Redefining Cost-Effective 400G Transmission. See you at OFC 2026!

About FIBERSTAMP

As the “Mail Carrier” of Open Optical Networks, FIBERSTAMP is dedicated to delivering economical, professional, and high-performance open optical network solutions to users worldwide.

Our portfolio includes 25G/50G/100G/200G/400G/800G optical transceiver modules, Active Optical Cables (AOCs) and Direct-Attach Cables (DACs), immersed liquid-cooled modules and interconnects, 100G/200G/400G /800G coherent optical modules, O-Band parallel DWDM non-coherent modules and subsystems, and ultra-high-definition video transmission products.

Driven by continuous innovation and exploration of emerging technologies, FIBERSTAMP is rapidly advancing into the era of Silicon Photonics-based 1600G pluggable modules, 1600G active copper cables, and co-packaged optics (NPO/CPO), maintaining its focus on differentiated innovation in optical network technology.