FIBERSTAMP’s Hybrid Architecture Active Copper Cable (ACC+) solutions redefine high-speed copper interconnects for AI, hyperscale data center, and cloud networking systems. By leveraging a patented Hybrid architecture that combines the strengths of existing PCC/ACC and AEC methodologies, these cables deliver dramatically lower power, latency, and cost compared with conventional active copper cables — while maintaining competitive reach performance.
Traditional Active Copper Cables (AECs) are often constrained by high power consumption and latency at next-generation data rates. FIBERSTAMP’s Hybrid ACC+ design strategically redesigns copper links at the system level to achieve:
- 50% reduction in power consumption
- 50% lower latency
- Up to 80% of traditional AEC reach performance
This balanced optimization enables robust performance even at high data rates where energy efficiency and speed are critical.
Key Features
- Transmission Reach: Up to 5 m optimized for server and switch copper interconnects
- Efficient DSP Utilization: Only 4-channel DSP per end for lower power and simpler signal processing
- High Link Quality: Pre-FEC BER better than 1E-8 for reliable high-speed links
- System Breakthrough: Comprehensive architectural innovations that elevate ACC performance over legacy AEC and ACC designs
Hybrid ACC+ Product Portfolio
| Product Name | Power Consumption |
| 800G OSFP HYBRID ACC+ | 7W |
| 800G QSFP-DD HYBRID ACC+ | 7W |
| 1.6T OSFP224 HYBRID ACC+ | 13W |
Application Scenarios:
By integrating Hybrid ACC+ technology, network architects gain a power-efficient, low-latency, cost-effective copper interconnect option that scales with next-generation data center demands.
