July 30, 2020 — In response to 5G network deployment needs, FIBERSTAMP, the leader beyond 200G in the optical communications industry, began a comprehensive upgrade of the design of xWDM transceivers above 10G as early as 2018, and now officially launched a full range of 5G fronthaul xWDM transceivers, including 10G CWDM, 10G DWDM, 25G CWDM, 25G DWDM and 25G LWDM series.
The 5G fronthaul network has stringent requirements on the bandwidth and delay of the bearer network. The current solution gives priority to using the eCPRI interface, and the delay requirement is less than 100µs. FIBERSTAMP's 5G fronthaul series xWDM transceivers comply with CPRI/eCPRI standards and are widely used in 25G Ethernet and 5G fronthaul networks. They have excellent characteristics such as high reliability and low latency. In order to meet the requirements of 5G fronthaul outdoor applications, FIBERSTAMP has completed the formulation and implementation of product design standards under industrial temperature environments. All of the newly launched 5G fronthaul xWDM transceivers meet industrial temperature standards and perform well in harsh outdoor environments.
FIBERSTAMP's full range of 5G fronthaul xWDM transceivers are shown as the following list.
FIBERSTAMP's 5G fronthaul series xWDM transceivers can also be combined with passive xWDM components to form a more complete 5G fronthaul xWDM solution that uses a pair or one fiber to realize multiple AAU to DU connections, and greatly saves fiber resources for operators and solves the problem of fiber resource shortage.
FIBERSTAMP Technology Co., Ltd., referred to as FIBERSTAMP, was established in 2019 and has achieved rapid development through the acquisition of relevant optical communication industry assets and technologies. FIBERSTAMP is committed to serving the next-generation data center interconnection, 5G optical transmission and high-definition video markets. The main products include 25G/50G/100G/200G/400G active optical cables, 25G/50G/100G/200G/400G/800G high-speed optical transceivers, 100G/200G/400G coherent optical modules, and SDI/HDMI optics.
As a communication technology platform and capital platform, FIBERSTAMP adheres to the basic concept of "mailing the future through time", and continuously develops and manufactures next-generation optical interconnect products with leading technology. The company is mainly positioned to develop key technologies for optical communications beyond 200G. The current technology platform includes high-speed COB, multi-channel optical micro-assembly technology, Silicon Photonics, etc.
The company's current investment and construction capacity is 5 million high-speed modules per year. Looking forward to 2021, it will complete the annual capacity expansion of 10 million optical modules. The main business locations of FIBERSTAMP are Taipei and Shenzhen.