AI applications demand swift and reliable data transmission. Cut-Through Switches enable immediate data transmission without processing entire frames, yet they require consistent end-to-end link speeds. Inconsistent network speeds can lead to latency issues, especially with large AI training data frames. To meet AI needs, FIBERSTAMP has enhanced end-to-end direct-attached connections. Their newly launched 800G and 400G DAC/ACC/AOC product line, available in QSFP-DD/OSFP form factors, offers vital technical support for data centers, significantly boosting data transmission and processing efficiency.

FIBERSTAMP addresses this by providing PCC/ACC/AOC options in QSFP-DD/OSFP form factors with branching capabilities, enabling both storage forwarding and cut-through switching to meet various AI application transmission needs.

Detailed product list is as follows,

The successive deployment of large-scale high-performance data centers to handle vast AI models like ChatGPT, BERT, and others is a crucial step for operators. FIBERSTAMP will continue launching more cost-effective AI application network architecture solutions to enhance network capabilities, aiding in the construction of stronger and more comprehensive network infrastructures.

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The Industrial Internet is a cornerstone of the Fourth Industrial Revolution, combining digital technology with manufacturing in a new application model and essential infrastructure. However, in specific scenarios such as extreme conditions of high temperature, humidity, or dryness, conventional optical modules might suffer damage or overheating, impacting overall performance. To address this issue, our Triple-Proof rugged modules employ explosion diagram analysis and extensive protective treatment. The PCB gold fingers utilize a unique nickel-palladium-gold process, while the PCBA and optical device sections employ comprehensive plating and coating enhancement processes, forming a dual protection of plating and Triple-Proof materials. The internal space and casing of the module are matched with a sealing ring to create a triple protection, isolating external media erosion.

Rigorously tested, the Triple-Proof rugged modules comply with international standards such as IP67 waterproof, dustproof, mold-proof, and neutral salt spray corrosion, ensuring long-term performance stability. Industries like pulp and paper, water/wastewater treatment, mining, tire, and rubber manufacturing demand higher standards from communication equipment in these environments. Our Triple-Proof rugged modules meet these stringent demands, providing reliable communication solutions to our customers.

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Furthermore, due to the application of the 50G PAM4 DML technology platform, this module excels in various parameters, including cost structure and power consumption.

400G QSFP-DD 2xFR4 Eye Diagram (CWDM4)

On the other hand, the 200G QSFP-DD 2x CWDM4 fan-out module smoothly transitions from the CS interface to a user-friendly LC interface. This module supports the fan-out of two 100G QSFP28 CWDM4 optical modules, enabling data centers to make a direct transition from 100G to 200G, providing a more flexible solution for clients.

With its 8x25G NRZ configuration, it offers a more convenient choice for clients in industry like supercomputing and high-frequency trading.

200G QSFP-DD 2xCWDM4 Eye Diagram

The launch of these fan-out optical modules by FIBERSTAMP signifies the emergence of low-order modulation technology within the optical communication industry, offering more possibilities for the future of optical communication development.

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In the current year, FIBERSTAMP has successfully introduced the 800G PCC/ACC and 800G SR8/AOC product series, achieving significant technological milestones. Simultaneously, we have achieved mass production of 400G silicon photonic modules and successfully developed the 800G DR8 silicon photonic module. These 800G DAC, 800G AOC, and 800G DR8 silicon photonic modules are capable of meeting transmission distance requirements from 1 meter to 2 kilometers, marking them as the “three trio ” of FIBERSTAMP in the field of 800G AI data center interconnect.

The showcase products are listed as follows:

With the rapid growth in data center traffic and increasing throughput demands, optical interconnect technology has seen swift advancements. As a pioneer in silicon photonics technology, FIBERSTAMP has overcome crucial challenges in silicon photonics technology development, thanks to its research and development capabilities and support from the silicon photonics industry chain. In the future, we will continue to release more silicon photonic products and further enhance interconnect cable deployment and liquid cooling technology, providing robust support for the development of AI interconnects.

OCP2023
The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software.

SC2023
The SC Conference is an international event that brings together the global supercomputing community. The conference will delve into areas such as high-performance computing, networking, data science, cloud computing, and especially engage in deep discussions on improving diversity and inclusion in the high-performance computing community.

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In Architecture One, it supports the electrical SerDes interface of 8x50G PAM4 and the optical interface of 4x100G PAM4. Think of SerDes as a communication wizard—it transforms data, accelerates data transfer with fewer connections, thus conserving resources. This upgrade facilitates a seamless transition from 100G to 400G for data centers. This product line includes the following silicon photonics optical modules: 100G QSFP28 DR1/FR1, 400G QSFP DD DR4/DR4+, 400G QSFP DD FR4, 400G QSFP DD CWDM4\LR4.

In Architecture Two, the combination of 4x100G PAM4 electrical interface and 400G QSFP112 SR4 and DR4 silicon photonics technology achieves high integration with fewer connections, resulting in reduced power consumption and cost savings. This product line includes the following silicon photonics optical modules: 400G QSFP112 DR4/DR4+, 400G QSFP112 FR4, 400G QSFP112 CWDM4/LR4.

With the maturation of silicon photonics technology, cost-effective 400G data centers are moving towards maturity and commercialization. The fusion of existing 7NM DSP technology with silicon photonics technology enables more efficient processing, transmission, and reception of data. The reduction in signal loss, component integration, and optimized power usage all contribute to lowering unit bit power consumption, making data centers more energy-efficient and cost-effective.

The post FIBERSTAMP Introduces Two Distinct 400G Data Center architectures based on silicon photonics technology, Providing Optimal Choices for Different Customers first appeared on FIBERSTAMP.

The 800G QSFP-DD ACC (Active Copper Cable) adheres to QSFP-DD800 MSA and IEEE802.3ck specifications, utilizing 16 pairs of 26AWG copper cables to support bidirectional transmission at 112GB/s across 8 channels, with backward compatibility. Compared to the PCC version, the ACC extends its transmission distance up to 4m, meeting the demands for short-distance interconnections. Leveraging the Re-Driver scheme, the typical power consumption is approximately 2.5W, with a latency of less than 20ns. In a league of its own, the ACC prevails in balancing the delicate intricacies of signal-to-noise ratios, outperforming conventional Re-Timer alternatives.

Additionally, its innovative manufacturing process ensures robust reliability and a lightweight form factor, weighing in at a mere 600g. And the 800G QSFP DD ACC shows the below superior SI performance and excellent consistency in 44GHZ network splitting.

FIBERSTAMP 800G QSFP-DD DAC series has proven its excellence in commercial error analyzer and MCB testing environments, showcasing exceptional pre-FEC BER of less than 1E-5 and post-FEC BER of less than 1E-15, ensuring high-quality transmission performance. Furthermore, under complex signal interference conditions, including the overlay of 8 near-end crosstalk and 7 far-end crosstalk, the product’s COM (Channel Operating Margin) exceeds 3dB, indicating its significant signal operating margin in highly disruptive environments, ensuring stable signal transmission even in the presence of substantial interference.

As a front-runner in 100G PAM4 technology for optical communication, FIBERSTAMP once again demonstrates its leading position in the high-speed copper cable domain, providing comprehensive and outstanding solutions for various application scenarios to meet diverse needs.

FIBERSTAMP High-Speed DAC Series Products Overview

In late August, FIBERSTAMP will launch the 800G OSFP DAC series samples, paving the way for data centers to embrace the 800G data era. As a leading carrier in the high-speed copper cable assemblies field, we are committed to continuous innovation and upgrades, providing data centers with reliable high-performance, high-speed transmission solutions. Stay tuned for more innovative products to help data centers tackle future challenges.

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Product Sheet,

The key technological innovation in this upgrade for the 200G data center is the development of high-performance 200G DR4/FR4 optical modules based on 4X50G PAM4 DML technology. These modules utilize PAM4 DML lasers and high linearity PAM4 DML drivers, providing significant cost and power savings compared to the previous use of EML technology.
Below is a typical eye diagram for the 200G QSFP56 FR4, showcasing its excellent OMA sensitivity surpassing -9dBm.

The additional 200G data center architecture by FIBERSTAMP also includes an architecture based on 8-channel optical NRZ, as shown below:

200G (8x25G NRZ) Data Center Product Sheet,

As a leading provider of economical data center solutions, FIBERSTAMP is committed to exploring the latest advancements in 200G data center architectures and product technologies. For instance, we are integrating silicon photonics technology and analog CDR technology. These new achievements will be launched within this year. We believe that 200G data centers will become the preferred choice for the majority of economical data centers.

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Up to now, the mainstream view and practice in the industry are to develop OpenZR+ specifications and standards. Highly versatile coherent DWDM optical devices can be provided through a feature combination of devices in the same form factor.

The FIBERSTAMP 400G QSFP-DD ZR+ adopts the latest OpenZR+ specifications and standards, enabling the product to be compatible with commonly used optical module form factors. With its excellent compatibility and scalability, it can transmit beyond 450km.

400G QSFP-DD ZR+

• Transmission distance up to 400km
• Advanced process 7nm DSP
• RX OSNR tolerance meets 24dB/0.1nm
• Operate at full C-band DWDM wavelengths at 75GHz (up to 64 channels) or 100GHz (up to 48 channels) channel spacing
• Triple-temperature power consumption < 22W

The combination of 400G OpenZR+ and high-density routing platform provides a more stable and efficient solution for data center interconnection. Therefore, it is also very important to optimize the integration of DWDM and routing, which can improve network transmission efficiency and reduce data center operating costs. FIBERSTAMP compact DCI BOX coherent transmission subsystem is a service platform specially designed for data center interconnects and metro network wavelength division multiplexing applications. Meet various needs and provide high-speed and large-capacity solutions for DCI.

FIBERSTAMP launches 1U/2U compact DCI Box coherent transmission systems

1U 1.6T DCI BOX 1.0

• Carry 2 OTU boards, each OTU has two CFP2 (line side) and QSFP-DD (client side) interfaces
• Support 400G/200G/100G optical modules
• Achieve bidirectional transmission of 3.2T services
• Intelligent B/S architecture for open network
• Support Web and NetRiver managements based on SNMP

2U 6.4T DCI BOX 2.0

• Unified 2U rack integrated Optical layer and electrical layer boards access
• Support 400G/200G/100G rates on line-side CFP2/QSFP-DD interfaces
• ROADM function supported up to 9 dimensions
• Maximum capacity of 6.4T single rack access
• Optical Layer Supports EDFA Cards, WSS Cards, OP Cards, etc.
• Enables shared or independent racks for optical and electrical devices, saving rack space and providing expansion flexibility.

FIBERSTAMP as an open optical network mail carrier, has a comprehensive line of DCI transmission products, including coherent optical modules, coherent DCI BOX and the series of optical transmission systems, etc. No matter the interconnection of individual data centers or the construction of large-scale metropolitan networks and wide area networks, FIBERSTAMP provides users with comprehensive and optimal coherent transmission solutions.

The post FIBERSTAMP Launches Economical DCI BOX and 400G QSFP DD ZR+ Coherent Optics for Open Optical Networks first appeared on FIBERSTAMP.

As businesses migrate to the cloud, data transmission becomes more massive and complex, bringing higher risks to network security and data protection in data centers. To address this challenge, FIBERSTAMP will be sharing its data center optical interconnection solution and best practices in network traffic diversion devices, focusing on the internal optical-electronic interconnection in IDC, IDC traffic diversion, and IDC metro network interconnection architecture. In addition, FIBERSTAMP will look forward to live meetings and discussions with North American operators and cloud service providers at booth 276 during the exhibition on May 17-18.

Internal Optical Interconnect Architecture and Middleware in IDC

FIBERSTAMP understands that the internal optical interconnect architecture in IDC is the cornerstone of modern data center networks, as it is a key factor in achieving high-speed, reliable, and low-latency data transmission, and improving data storage security, computing performance, and reliability. Therefore, FIBERSTAMP provides large-scale data center architectures with different rates of 100G/200G/400G/800G, empowering customers in different application scenarios to enhance data center performance and security.

IDC Diversion: Best Practices for Parallel Optical Module Technology

In the IDC diversion – best practices of parallel optical module technology, parallel optical modules can combine multiple fibers or multiple wavelength-division multiplexing channels in network diversion for higher bandwidth density, meeting the needs of high-density data centers in network security applications. With multiple fibers transmitting in parallel, cable length and complexity can be reduced, improving transmission reliability and stability.

FIBERSTAMP showcases a variety of parallel optical modules with different transmission rates to meet the diverse needs of segmented markets.

IDC Metro Interconnect: Coherent DCI BOX subsystems and coherent modules

IDC metro interconnect based on coherent wavelength division multiplexing (WDM) technology offers advantages such as long transmission distances, low signal attenuation, and high bandwidth. FIBERSTAMP offers a range of high-performance coherent modules and advanced modulation technologies, along with large-capacity DCI box subsystem equipment to achieve high-speed data transmission over ultra-long distances for data backup and disaster recovery, improving data security.

FIBERSTAMP Coherent DCI BOX Subsystem and Coherent Module Product List

In the digital era, optical interconnect in data centers has become an important means of high-speed connectivity. As an excellent provider of open optical network middleware, FIBERSTAMP is committed to adopting new technologies and designs to add value to optical networks and continuously optimize optical interconnect solutions for data centers. North American operators and cloud service providers can achieve more efficient data transmission and security by working with FIBERSTAMP. We look forward to exchanging ideas with you at the exhibition and waiting for your visit at Booth 276!

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48G SDI Solutions

FIBERSTAMP released brand new 48G SDI QSFP+ solutions consist of 48G SDI QSFP+ optical extender and 48G SDI QSFP+ PSM4 optical modules, 8K bidirectional transmission up to 20 km at up to 47.52Gbps (11.88Gbps per channel) via 4x duplex SMF, easily transmitting 8K digital content losslessly between two video production centers, improving the efficiency and quality of content production.

Application

Meanwhile, providing 4x12G-SDI CWDM optical extenders kits for the enormous demands of live streaming broadcast fulfills the requirement of transmitting 4 uncompressed 12G-SDI signals over a 10km single-mode fiber, enabling users to quickly deploy 8K uncompressed SDI baseband fiber extensions and simplifying user operations.

Application

12G SDI Solutions

FIBERSTAMP SDI Optics Video Transmission solutions are consist of 12G SDI SFP, 12G SDI BIDI SFP, 12G SDI CWDM optical module, 12G SDI optical extender, and passive CWDM Mux/Demux.

Application

Broadcast High-speed optical modules

FIBERSTAMP range of broadcast high-speed optical modules include parallel 100G/200G/400G high-speed datacom optical modules, xWDM 100G/200G/400G high-speed datacom optical modules and GPON & XG(S)-PON OLT Optical Modules.

Application

FIBERSTAMP is an innovative developer of optical transceivers for global SDI communications and broadcast and television network communications. As the era of 8K commercialization approaches, optimizing and deploying fiber optic network for broadcast operators is imperative. FIBERSTAMP is expected to collaborate with North American broadcast equipment vendors and operators to drive network speed and quality forward.

Welcome to visit us at Booth W3958 from April 15-19 at NAB Show 2023!

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