Visual Touchscreen Operation Eliminates the Need for an External PC

The Visual 800G CHECKER combines the tester and a 10.1-inch FHD (1920 × 1200) industrial touchscreen into a single integrated platform. The tablet features 10-point capacitive touch, hardened tempered glass, an Intel® Celeron® N5100 processor, 8 GB RAM, 128 GB storage, and supports Windows 10/11. Engineers can perform BER testing, real-time DDM monitoring, EEPROM read/write, and FEC margin estimation directly from the touchscreen, enabling true plug-and-test operation without carrying a laptop into the field.

Dual-Port Design Supports 800G, 400G and 200G Testing

The system provides one QSFP-DD port and one OSFP or OSFP-RHS port (software selectable, one active at a time). It supports 8 × 53.125 GBd PAM4 (800G) and 8 × 26.5625 GBd PAM4 (400G) BER testing, and is compatible with a wide range of QSFP112, QSFP56, QSFP28, OSFP112, and OSFP56 optical modules.Key capabilities include:

• Real-time CMIS V4.0 status monitoring with DDM diagnostics for voltage, temperature, bias current, and optical power.
• Comprehensive PRBSQ7/9/10/11/13/15/20/23/31 and SSPRQ pattern support.
• Flexible EEPROM read/write for optical module compatibility configuration.
• Advanced FEC margin estimation and correction capability calculation for in-depth link quality evaluation.

Removable Battery for Portable Field Testing

The Visual 800G CHECKER integrates a 142Wh removable lithium battery, providing up to 3 hours of operating time (including the optical module under test). The system also supports external 12 V DC power input and battery charging.

The battery complies with UN38.3 transportation requirements and applicable lithium battery safety standards. As a battery rated between 100 Wh and 160 Wh, it can be carried on board with airline approval, making it ideal for field engineers and on-site service teams. The complete system weighs approximately 5 kg (including the battery module) and includes shoulder strap and backpack attachment points for convenient mobility.

Industrial Reliability for Demanding Environments

The integrated industrial tablet is certified to IP65 for dust and water resistance, MIL-STD-810G for environmental durability, certified to a 1.22-meter drop test, and meets ATEX Zone 2/22 requirements for hazardous environments.

The tester features a durable aluminum enclosure with optimized airflow and dual 60 × 60 × 25 mm cooling fans. Its embedded tablet design provides physical separation from the internal testing hardware, ensuring reliable long-term operation. The complete system complies with CE, FCC, and RoHS standards.

Application Scenarios

Ordering Information

The Visual 800G CHECKER is now available for order in two configurations:

• 800G QSFP-DD + OSFP
• 800G QSFP-DD + OSFP-RHS

Both configurations include the integrated industrial touchscreen tablet and removable battery module.

The post FIBERSTAMP Launches Visual 800G CHECKER to Simplify Data Center Operations first appeared on FIBERSTAMP.

For short-reach interconnect applications, the white paper examines the advantages of NRZ modulation and “Half-DSP” architectures, including LPO and hybrid approaches, in reducing latency and power consumption. It also highlights the increasing adoption of PAM4 modulation as data rates continue to scale.

For data center interconnect (DCI) applications, the white paper discusses O-BAND incoherent DWDM technology as a cost-effective complementary approach to traditional C-BAND coherent solutions. The technology enables optimized deployment for transmission distances ranging from 2 km to 30 km, with advantages in latency, power efficiency, and overall system cost.

Looking toward the 1.6T era, the white paper analyzes three optical architecture approaches: standard pluggable optical modules, external laser source-based pluggable modules, and external laser source NPO (Near-Packaged Optics) architectures. These approaches are evaluated based on their respective deployment scenarios across near-term, mid-term, and long-term network evolution stages.

At the network architecture level, the white paper highlights all-optical switching solutions based on AWGR (Arrayed Waveguide Grating Router) technology. By integrating AWGR with optical amplification technologies such as EDFA or SOA, these architectures enable nanosecond-level switching latency at critical network nodes, reduce power consumption, and help overcome optical-electrical-optical (O-E-O) conversion limitations, providing a scalable architectural reference for large-scale AI cluster interconnects.

The full white paper is now available for download at :

https://www.fiberstamp.com/brochures/Next-Generation-AI%20Computing%20-Network%20-Architecture.pdf

The post FIBERSTAMP Releases White Paper on Next-Generation AI Computing Network Architecture and Optical Interconnect Technology Analysis first appeared on FIBERSTAMP.

The awarded products include:

• 800G OSFP HYBRID ACC+ — Rated 4.0/5.0
• 1.6T OSFP224 HYBRID PSM8-AOC-SiPho — Rated 4.0/5.0
• 800G OSFP HYBRID VR8-AOC — Rated 3.5/5.0

This recognition underscores industry validation of FIBERSTAMP’s pioneering advancements and meaningful contributions to hybrid-architecture interconnect innovation.

Breakthrough HYBRID Electrical Architecture: 800G OSFP HYBRID ACC+

Designed for commercial interconnects exceeding 5 meters, the 800G OSFP HYBRID ACC+ delivers approximately 50% lower latency and cost compared to traditional AEC architectures.

Key Technical Highlights:

• Efficient Architecture: Utilizes 16 copper pairs to enable 8-channel 112G PAM4 electrical interconnects, requiring only a 4-channel DSP per end—compared to traditional AEC solutions that require 8-channel DSPs.
• Superior Signal Performance: Achieves a target pre-FEC BER better than 1E-8, significantly enhancing system SNR and receive eye quality.
• Lower Power Consumption: Typical power consumption is approximately 7W per end, about 40% lower than conventional AEC solutions (~12W per end).
• Cost and Latency Optimization: Delivers roughly 50% improvement in both cost and latency compared to traditional AEC architectures, outperforming standard ACC designs.

Lightwave Judge’s comment: “The performance and power savings enabled by the Fiberstamp 800G OSFP HYBRID ACC+ introduce a better solution for today’s ACC applications at 800G/port speeds.”

Advancing 1.6T Interconnects with Silicon Photonics: 1.6T OSFP224 HYBRID PSM8-AOC-SiPho

Built on an advanced silicon photonics (SiPho) platform, the 1.6T OSFP224 HYBRID PSM8-AOC-SiPho is engineered for high-performance data centers and AI compute clusters. The module supports transmission distances of at least 500 meters over single-mode fiber (SMF).

Key Performance Specifications:

• High-Speed Transmission: Supports ≥500m over SMF.
• Lower Power Consumption: Maximum power consumption below 21W, approximately 20% lower than traditional DSP-based solutions.
• Ultra-Low Latency: Reduces link latency by around 50% compared to conventional DSP AOC architectures.
• Excellent Signal Integrity: Achieves a pre-FEC BER of 1E-8 over a 500m SMF link.

Lightwave Judge’s comment:  “This product provides an economic solution before 200G VCSEL becomes viable.”

High-Efficiency Multimode Connectivity for AI Deployments: 800G OSFP HYBRID VR8-AOC

The 800G OSFP HYBRID VR8-AOC is engineered for next-generation data center and AI-driven applications, supporting multimode fiber connectivity.

Core Features and Benefits:

• High-Speed Performance: Supports up to 30m over OM3 and 50m over OM4 multimode fiber (with KP4-FEC enabled).
• Lower Power Consumption: Consumes less than 9W, approximately 30% lower than traditional DSP solutions.
• Reduced Latency: Cuts link latency by roughly 50% compared to conventional DSP-based AOCs.
• Superior Signal Quality: Achieves pre-FEC BER levels of E-7/E-8 over a 50m OM4 link.
• Cost Advantage: Overall system cost reduced by approximately 21% compared to existing DSP solutions.

Lightwave Judge’s comment: “A winning combination: High capability, low power consumption, ultra-low latency.”

Powering the Future of AI and Data Center Infrastructure

The 2026 Lightwave Innovation Award recognition reinforces FIBERSTAMP’s commitment to advancing HYBRID interconnect architectures and silicon photonics technologies. By optimizing DSP architecture, energy efficiency, and system design, FIBERSTAMP continues to enable scalable, low-latency, and cost-effective connectivity solutions for global data centers and AI infrastructure.

The post FIBERSTAMP Wins 2026 Lightwave Innovation Award — HYBRID 800G ACC+, 800G AOC, and 1.6T Silicon Photonics Active Optical Cables Honored first appeared on FIBERSTAMP.

The 400G QSFP-DD ER4-30km adopts 4×100G PAM4 modulation and operates across the 1295.56 nm–1309.14 nm LAN-WDM band with a dual-fiber LC interface, supporting transmission distances up to 30 km. In lab testing, the module successfully completed a 24-hour error-free 400GE loopback with KP4 FEC, confirming its superior link stability and reliability.

Key Performance Highlights

• Average transmit power: +3 dBm per channel

• TDECQ (Transmitter and Dispersion Eye Closure for PAM4): as low as 2.28 dB

• Receiver sensitivity: better than –12.5 dBm per channel

• Power consumption: <13 W

Figure 1：Application Scenarios

Versatile Application Scenarios

• Data Center Interconnect (DCI): Enables direct 400G metro backbone connections, minimizing O-E-O conversions and enhancing transmission efficiency.

• 5G Fronthaul, Midhaul, and Backhaul: Supports long-reach, high-capacity transmission between AAU and DU under C-RAN architecture, accelerating large-scale 5G deployment.

• Enterprise and Cloud Connectivity: Provides reliable, low-latency private links for finance, government, and cloud applications, empowering digital transformation.

With the launch of this new product, FIBERSTAMP strengthens its leadership in open optical interconnect innovation. Guided by its principles of openness, innovation, and differentiation, the company remains committed to delivering high-performance, energy-efficient, and cost-optimized optical connectivity solutions—driving the data communication industry toward a faster, smarter, and greener future.

The post FIBERSTAMP Launches Narrow-Grid LAN-WDM 400G QSFP-DD ER4-30km Optical Module for Metro Ethernet Applications first appeared on FIBERSTAMP.

Technology-Driven Innovation: Breaking Barriers in Speed and Efficiency
As data centers rapidly transition to 200G/400G architectures, traditional optical modules are reaching their limits in terms of speed, power efficiency, and interoperability. FIBERSTAMP’s 200G QSFP56 SR2 optical module delivers a leap in performance through three key innovations—pushing the boundaries of what’s possible in next-gen network infrastructure.

High-Speed, Low-Power Performance

• Supports 200Gbps (2×100G PAM4) transmission to meet the bandwidth demands of AI/GPU clusters, cloud computing, and other data-intensive applications.
• Built with advanced energy-efficient design, the module achieves up to 30% lower power consumption compared to traditional solutions—supporting the development of greener, low-carbon data centers.

Broad Compatibility and Flexible Connectivity

• Eliminates switch platform limitations with support for multiple interface standards, including 400G QSFP112 and 400G QSFP56-DD.
• Enables diverse AOC interconnect configurations for seamless integration across heterogeneous devices, significantly reducing the cost and complexity of network upgrades.

Certified Reliability for Mission-Critical Networks
The FIBERSTAMP 200G QSFP56 SR2 optical module has passed multiple industry certifications, fully complying with QSFP56 MSA and IEEE 802.3 standards. When paired with OM4 multimode fiber, it supports transmission distances of up to 100 meters (SR2), making it ideal for short-reach interconnects within data centers.

400G QSFP112 AOC to 2×200G QSFP56 SR2 Breakout
Breaking through device port limitations and enabling flexible 400G-to-200G interconnects. This innovation is perfectly suitable for high-speed, heterogeneous network architectures.

400G QSFP56-DD SR4 AOC Breakout to 2×200G QSFP56 SR2
Meeting the need for efficient interconnects across various switch environments, enabling flexible deployment in data centers.

800G OSFP SR8 Breakout to 4×200G QSFP56 SR2
Unlock maximum flexibility by breaking out a single 800G OSFP SR8 port into four 200G QSFP56 SR2 —ideal for scalable, high-density deployments in modern data centers.

Comprehensive Coverage of Core Application Scenarios

• Data Center Architecture Upgrades: Supports 200G spine-leaf network transformations, effectively easing port density constraints and optimizing data center resource allocation.
• Heterogeneous Network Integration: Addresses protocol and speed mismatches in multi-vendor environments, reducing operational complexity and accelerating network evolution.
• Accelerated AI Compute Interconnects: Delivers high-speed, low-latency connectivity for AI training, high-performance computing, and other bandwidth-intensive workloads.

FIBERSTAMP has long been committed to driving industry transformation through technological innovation, with years of deep expertise in optical modules. The newly launched 200G QSFP56 SR2 module not only fills a critical gap in the market for high-performance, cost-effective short-reach interconnect solutions, but also introduces an innovative breakout design that empowers customers to build more efficient and open data center network eco-systems.

For more information, please feel free to contact FIBERSTAMP sales team.

Email  Address: sales@fiberstamp.com

Telephone Number: +65 6022 0607

The post FIBERSTAMP Launches 2×100G PAM4-Based 200G QSFP56 SR2 Optical Module to Power Next-Gen Data Center Connectivity first appeared on FIBERSTAMP.

April 15, 2025 Singapore – FIBERSTAMP, a global leader in optical communication solutions, has launched a new cost-effective short-reach data center interconnect solution: the 400G QSFP-DD SR4 to 4×100G single-lambda QSFP28/SFP112 SR1. 

Designed to meet the growing demands of modern data centers for higher speed, greater density, and lower costs. This innovative solution significantly reduces deployment complexity and total cost of ownership (TCO) through an advanced architecture. It offers a flexible and efficient connectivity option for cloud computing, AI clusters, and hyperscale data centers.

Key Highlights of the Solution

High-Density and Flexible Scalability

• Utilizes a 400G QSFP-DD SR4 optical module as the uplink port, branching into four independent 100G QSFP28/SFP112 SR1 downlink connections via single-mode or multimode fiber. This enables 1:4 non-blocking transmission, boosting single-port bandwidth utilization by 300% and significantly conserving switch port resources.
• Fully compatible with mainstream data center Top-of-Rack (ToR) architectures and supports leading switching platforms such as NVIDIA and Broadcom.

Breakthrough in Single-Lambda Technology

• Powered by FIBERSTAMP’s proprietary single-lambda 100G PAM4 modulation technology, this solution overcomes the limitations of traditional parallel multi-fiber approaches.
• It enables stable 100-meter transmission over OM4 multimode fiber while reducing power consumption by 20% compared to similar solutions—meeting the stringent energy efficiency demands of short-reach SR applications.

Cost-Effective Deployment

• Compared to traditional 400G full-optical module networking, this solution reduces the number of high-speed optical-electrical conversion units by up to 75%, significantly lowering equipment procurement costs.
• 100G single-lambda transmission minimizes fiber usage, further cutting down overall infrastructure expenses.
• Supports hot-swappable, plug-and-play operation with no need to modify existing cabling infrastructure—dramatically shortening deployment cycles.

Full-Spectrum Compatibility

Downlink ports can be flexibly configured with either 100G QSFP28 SR1 or 100G SFP112 SR1 modules, ensuring compatibility with both existing 100G infrastructure and emerging single-lambda standards—safeguarding customer investments.

Application Scenarios

• AI/GPU Cluster Interconnects: Efficiently links high-performance compute nodes while reducing latency and power consumption.
• Cloud Data Center Spine-Leaf Architectures: Optimizes east-west traffic and alleviates bandwidth pressure at the core layer.
• Storage Network Upgrades: Seamlessly supports high-speed storage protocols such as NVMe over Fabrics.

Amid the explosive surge in AI and computing power demands, the demand of high-performance, cost-effective 400G/100G interconnect solutions has never been more urgent. FIBERSTAMP’s cutting-edge design delivers the ideal balance between performance and affordability, empowering data centers to make a seamless, future-ready transition to next-generation network architectures—while minimizing capital investment.

For more information, please feel free to contact FIBERSTAMP sales team.

Email  Address: sales@fiberstamp.com

Telephone Number: +65 6022 0607

The post FIBERSTAMP Launches 400G QSFP-DD SR4 to 4×100G Single-Lambda QSFP28/SFP112 SR1 Cost-Effective Short-Reach Data Center Solution first appeared on FIBERSTAMP.

The Color X 100G QSFP28 DWDM1 O-BAND Silicon Photonics integrates an advanced DSP chip for 4x25G NRZ to 100G PAM4 conversion and a monolithic silicon MZ modulation chip with a 150GHz O-BAND DWDM CWL laser. It offers low power consumption and high performance, with key advantages as follows:

• TDECQ per channel <2.4dB (better than protocol spec <3.4dB)
• Rx Sens(OMA) < -9dBm@2.4e-4 Pre-FEC 53GBd PAM4 (better than spec <-6.1dBm)
• Maximum power consumption <3.5W

FIBERSTAMP leverages silicon photonics with traditional technology to develop cost-effective, non-coherent DWDM solutions for 100G DCI networks, ensuring market leadership through innovation.

The 800G QSFP-DD CWDM8/LR8 enables 800GE transmission over two single-mode fibers (2km/10km), enhancing long-distance interconnects for telecom, data centers, and cloud computing. It reduces power consumption and system costs while offering flexible, high-performance solutions. 

Key features include:
Supports 2km/10km transmission over dual single-mode fibers
Duplex LC interface
CWDM8 (2km) with TEC-cooled CWDM EML laser and PIN detector
LWDM8 (10km) with TEC-cooled LWDM EML laser and PIN detector
Efficient reuse of miniature CWDM8 and LWDM8 optical devices
8x100G PAM4 electrical interface with a 5nm DSP chip

FIBERSTAMP leverages its deep R&D expertise in 8-channel TOSA/ROSA integration to deliver 200G QSFP-DD LR8 (8x25G NRZ), 400G QSFP-DD LR8 (8x50G PAM4), and Open 800G QSFP-DD CWDM8/LR8 solutions.

Lightwave + BTR Innovation Reviews honors top optical networking products and services, evaluated by industry experts from leading service providers, technology firms, analysts, and media. FIBERSTAMP’s double win highlights its leadership in driving the future of high-speed, high-capacity Optical Communication Networks.

The 100G QSFP28 DWDM1 O-BAND Silicon Photonics received a high score of 4.5/5, highlighting its originality, innovation, and customer impact. Meanwhile, the 800G QSFP-DD CWDM8/LR8 earned a 3.5/5, showcasing its efficiency in addressing next-generation connectivity needs.

The post FIBERSTAMP WINS TWO LIGHTWAVE INNOVATION AWARDS FOR 100G QSFP28 DWDM1 O-BAND AND 800G QSFP-DD CWDM8 LR8 first appeared on FIBERSTAMP.

200G/400G Networks for Low-latency, High-frequency Data Centers and Edge Data Centers

The 200G QSFP-DD SR8/PSM8 based on high-frequency trading data center interconnect technology has been widely adopted by numerous customers all around the world. With the goal of ensuring technological continuity, FIBERSTAMP has extended its offerings to include 200G QSFP-DD PSM8 and 400G QSFP-DD XPSM8 solutions, providing robust and efficient connectivity for next-generation data centers.

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We define edge data centers as facilities positioned at the periphery of future 5G or 6G core networks, designed to ensure real-time data responsiveness. These data centers demand ultra-low latency and high-performance solutions, which are perfectly addressed by FIBERSTAMP’s 200G QSFP-DD 2×CWDM4 and 400G QSFP-DD 2×FR4 optical modules.

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We understand that high-frequency trading data centers and edge data centers share similar requirements for rapid network response. Customers can flexibly choose the most suitable solutions to meet their specific needs.

AI&DC 1.6T R&D Plan Launched (Stay tuned!)

The challenge of widespread deployment of 1.6T lies in power consumption design. Various methods for reducing power consumption have been proposed in the industry. Our 1.6T product plan is based on:

• 1.6T OSFP-XD LPO/LRO plan
• 1.6T OSFP-XD PCC/ACC plan

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800G Product Upgrade Plan for Metro Data Center Interconnect

• 800G QSFP-DD FR8/LR8 (single-wavelength 100G)
• 800G QSFP-DD DR4/FR4/LR4 (single-wavelength 200G)

Complete Solution for Immersion Liquid Cooling Interconnect Data Centers

FIBERSTAMP is the company with the richest practical experience in this field. Our plan includes:

• Launching immersion liquid cooling optical extenders in all packaging formats
• Launching 800G/400G immersion liquid cooling optical modules based on silicon photonics technology platform
• Launching 800G/400G PCC/ACC immersion high-speed copper cables

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Innovation in Short-Distance Transmission Optical Modules for Metro DWDM Interconnect

• 100G QSFP28 PSM DWDM4 -C-BAND –48 wavelengths –80km
• 100G QSFP28 DWDM1 –O-BAND 150GHz –16 wavelengths –15km
• 100G QSFP28 DWDM1 -O-BAND 200GHz -16 wavelengths -30km
• 400G QSFP DD PSM DWDM4 –O-BAND 200GHz -6 wavelengths 10km (30km with external SOA)

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FIBERSTAMP continues to drive innovation at the forefront of optical module technology, particularly in the fields of low-latency high-frequency trading, edge computing, and data center interconnect. As the demand for AI computing power rises, FIBERSTAMP’s technological advancements bring more efficient and flexible differentiated solutions to the industry, driving the evolution of global network architecture. In the future, FIBERSTAMP will continue to provide customers with high-quality, innovative products, further promoting the efficient development of global optical networks.

The post 2025 Optical Transceivers Innovation Plan & Insights on Evolving Network Architectures! –FIBERSTAMP first appeared on FIBERSTAMP.

25G SFP28 ZR 80km

• Both TOSA (Transmitter Optical Sub-Assembly) and ROSA (Receiver Optical Sub-Assembly) utilize hermetically sealed packaging for stability and reliability, meeting telecom-grade application requirements.
• The TOSA employs an EML (Electro-Absorption Modulated Laser) 1310nm laser with TEC (Thermo-Electric Cooler) cooling.
• The ROSA integrates a PIN photodiode and SOA (Semiconductor Optical Amplifier) to provide a 30dB optical budget.
• Supports 80km dual-fiber single-mode transmission with host RS-FEC (Reed-Solomon Forward Error Correction) enabled.
• Product power consumption is less than 2.5W.

40G QSFP+ ZR4 80km

• Both TOSA and ROSA utilize hermetically sealed packaging for stability and reliability, meeting telecom-grade application requirements.
• The TOSA uses a 4-wavelength LAN-WDM DML (Directly Modulated Laser) with TEC cooling.
• The ROSA employs a high-sensitivity APD (Avalanche Photodiode) optical detector to provide a 28dB optical budget.
• Supports 80km dual-fiber single-mode transmission.
• Product power consumption is less than 4.5W.

100G QSFP28 BiDi ZR4 80km

• Both TOSA and ROSA utilize hermetically sealed packaging for stability and reliability, meeting telecom-grade application requirements.
• Designed with 8-wavelength LAN-WDM BIDI (Bidirectional) technology, used in pairs.
• The TOSA uses a 4-wavelength EML LAN-WDM laser with TEC cooling.
• The ROSA integrates a PIN photodiode and SOA to provide a 30dB optical budget.
• Supports 80km single-fiber single-mode transmission with host RS-FEC enabled.
• Built-in 4×25G CDR (Clock and Data Recovery).
• Product power consumption is less than 6.5W.

FIBERSTAMP has always been committed to providing high-performance, high-quality, and reliable optical communication solutions to global customers. The launch of the 25G SFP28 ZR, 40G QSFP+ ZR4, and 100G QSFP28 ZR4 BiDi optical transceivers will further enhance our market competitiveness in ultra-long-haul telecom-grade applications, providing even better optical transmission solutions for 5G communications, telecom and MAN applications.

The post FIBERSTAMP Launches Long-Haul Telecom-Grade Optical Transceivers first appeared on FIBERSTAMP.

At Network X 2024 in Paris, France, FIBERSTAMP presented our 100G SFP112 products, which features a compact design that effectively simplifies the choice of dual – and four-wavelength optical transmission, reducing space footprint, power consumption and overall cost.

The 100G SFP112 series uses an advanced 7nm CMOS DSP design, adopts 53G Baud EML laser or VCSEL laser, and supports 100G single-channel transmission based on PAM4 modulation technology. Compliant with the IEEE 802.3ck SR1/LR1/ER1 Lite single-mode fiber transmission specification and the 100G Lambda MSA standard, 100G SFP112 ER1 is also equipped with a highly sensitive APD photodiode that supports transmission up to 30 km.

As the industry’s leading and smallest package 100G SFP112 optical transceiver, the product is widely considered to be the next generation of 100G pluggable optical transceiver, similar to the 10G SFP+ module path. With a simplified structure and fewer components, the 100G SFP112 is suitable for mass production and forward compatibility, making it ideal for high-density routers and switches, while providing an ideal upgrade for the next generation of 100G optical networks.

100G SFP112 SR1

• COB package 100G PAM4 850nm VCESL and PIN
• Up to 100m on MMF OM4/OM5 with the HOST FEC
• Dual LC/APC
• SFP112 MSA
• Supports the CMIS 4.0 protocol
• Built-in low power DSP
• The power consumption of the product is less than 2.1W at 70℃

100G SFP112 LR1 Lite

• Power consumption is less than 3.5W at 70℃
• Airtight package 100G PAM4 1310 EML and PIN
• Up to 10Km on SMF with the HOST FEC
• Dual LC/UPC
• SFP112 MSA
• Supports the CMIS 4.0 protocol
• Built-in low power DSP

100G SFP112 ER1 Lite

• Airtight package 100G PAM4 1310 EML and APD
• Up to 30Km on SMF with the HOST FEC
• Dual LC/UPC
• SFP112 MSA
• Supports the CMIS 4.0 protocol
• Built-in low power DSP
• Power consumption is less than 3.5W at 70℃

The post FIBERSTAMP introduces the single-wave 100G SFP112 SR1/LR1/ER1 optical transceivers first appeared on FIBERSTAMP.