FIBERSTAMP TECHNOLOGY CO., LTD. headquarters in Taiwan, and has multiple R&D, production, marketing, logistics bases of its own. The company is committed to provide professional, economical and simple optical interconnection hardware and integrated solutions for Data Center, 5G Open RAN, Transport Network and UHD video transmission systems.
Persisting of the product principles of Rationalism, Pragmatism, Economism and User-driven, based on multiple technology platforms and design architectures, FIBERSTAMP has developed complete and targeted optical product lines of differentiation of performance, design and cost, which are well applicable for diverse and complex applications and environments.
FIBERSTAMP is committed to build robust customer trust through concerning of every bit of need and potential risk of customers, and wish to construct a better future of open optical network through the joint effort of it and all partners!
Mail the Future through Time, facing the era of openness and synergy, FIBERSTAMP is always with you!
Optical transceivers, direct-attached copper cables (DACs) and active optical cables (AOCs) (10/25/ 50/100/200/400/800G)
Coherent communication optical transceivers and DCI coherent transmission subsystems (100/200/400/800G)
3/12G-SDI UHD video optical transceivers, optical extenders, HDMI AOCs etc.
Data center photoelectric interconnection
Data center photoelectric interconnection: white box ethernet switches, optical transceivers, interconnection cable assembly (DAC and AOC), MPO cabling products.
Transport Network
Transport Network: active transmission devices, coherent optical transceivers, optical amplifiers, AAWG and other transmission subsystems.
5G Open RAN fronthaul
5G Open RAN fronthaul: HAOC, gray and color optical transceivers, passive WDM devices
UHD video transmission
UHD video transmission: 3G/12G-SDI optical transceivers, optical extenders, passive WDM devices, HDMI transmission lines, etc.
Free space optical packaging platform
COC optical device packaging platform
Software & hardware design platform
COB assembly platform
Semiconductor optical chip and Silicon Photonics platform
Coherent communication technology platform